Chong Precision Engineering
29 & 31, Lintang Beringin 6,
Diamond Valley Industrial Park,
Jalan Permatang Damar Laut,
11960 Penang,

Wafer Inspection System

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Wafer Inspection System Automation Equipment

  • High-resolution and high-precision X - Y table.
  • Capable of handling 12″ wafer.
  • High speed inspection.
  • Micro defect inspection of up to 5 micron.
  • Window platform with user-defined specification.
  • Built-in calibration feature.
  • Auto-generation of GR & R report.
  • Library based uploading for different types of die.
  • Automated optical inspection of micro wafer defects.
  • Automated defect classification.
  • Optional storage of defect images for engineering analysis.
  • Wafer map creation / updated of loaded wafer map.
  • Optional inking capability for defect dies.
  • Statistical descriptive analysis of defects.
  • Die counting.

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